Possémé, Nicolas: search on Z-Library

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1

Surface affinity role in graphoepitaxy of lamellar block copolymers

Claveau, Guillaume, Quemere, Patrick, Argoud, Maxime, Hazart, Jerome, Barros, Patricia Pimenta, Sarrazin, Aurelien, Posseme, Nicolas, Tiron, Raluca, Chevalier, Xavier, Nicolet, Celia, Navarro, Christo

Journal:

Journal of Micro/Nanolithography MEMS and MOEMS

Year:

2016

Language:

english

File:

PDF, 6.38 MB

english, 2016

2

Plasma Etching Processes for Interconnect Realization in VLSI || Interaction Plasma/Dielectric

Posseme, Nicolas

Year:

2015

Language:

english

File:

PDF, 2.63 MB

english, 2015

3

Isotropic dry etching of Si selectively to Si 0.7 Ge 0.3 for CMOS sub-10ânm applications

Rachidi, Sana, Campo, Alain, Loup, Virginie, Vizioz, Christian, Hartmann, Jean-Michel, Barnola, SÃ©bastien, Posseme, Nicolas

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

2020

Language:

english

File:

PDF, 4.23 MB

english, 2020

4

Thin layer etching of low-k SiCO spacer using hydrogen ion implantation followed by hydrofluoric acid

Posseme, Nicolas, Garcia-Barros, Maxime, Leverd, François, Benoit, Daniel, Pollet, Olivier, Audoit, Guillaume, Guedj, Cyril, Jannaud, Audrey, Barnola, S.

Journal:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures

Year:

2018

Language:

english

File:

PDF, 1.82 MB

english, 2018

5

Characterization of photoresist films exposed to high-dose implantation conditions

Croisy, Marion, Pargon, Erwine, Jenny, Cécile, Richard, Claire, Guiheux, Denis, Mariolle, Denis, Poulain, Christophe, Campo, Alain, Possémé, Nicolas

Journal:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures

Year:

2018

Language:

english

File:

PDF, 6.94 MB

english, 2018

6

Plasma Etching Processes for Interconnect Realization in VLSI || Introduction

Posseme, Nicolas

Year:

2015

File:

PDF, 1.13 MB

2015

7

Plasma Etching Processes for Interconnect Realization in VLSI || Porous SiOCH Film Integration

Posseme, Nicolas

Year:

2015

Language:

english

File:

PDF, 6.82 MB

english, 2015

8

Characterization and Development of High Dose Implanted Resist Stripping Processes

Croisy, Marion, Jenny, Cécile, Richard, Claire, Guiheux, Denis, Campo, Alain, Pargon, Erwine, Possémé, Nicolas

Journal:

Solid State Phenomena

Year:

2016

Language:

english

File:

PDF, 4.13 MB

english, 2016

9

Silicon Anodization As a New Way to Transfer 3D Nano-Imprinted Pattern into a Substrate

Nouri, Lamia, Posseme, Nicolas, Landis, Stéfan, Milesi, Frederic, Gaillard, Frédéric, Mariolle, Denis, Licitra, Christophe

Journal:

ECS Transactions

Year:

2017

Language:

english

File:

PDF, 856 KB

english, 2017

10

Study of Resist Strip Chemistries for Ultra Low-k/Cu Interconnect

Xu, Han, David, Thibaut, Xu, Yin, Tarasov, Vlad, Possémé, Nicolas, Louis, Didier

Journal:

Solid State Phenomena

Year:

2008

Language:

english

File:

PDF, 2.10 MB

english, 2008

11

Impact of Downstream Ash Plasmas on Ultra Low-k Materials

Possémé, Nicolas, David, Thibaut, Meininger, P., Louveau, O., Chevolleau, T., Joubert, O., Louis, Didier

Journal:

Solid State Phenomena

Year:

2005

Language:

english

File:

PDF, 620 KB

english, 2005

12

Political Theory, History of Political Thought, and Methodology

Xu, Han, David, Thibaut, Xu, Yin, Tarasov, Vlad, Possémé, Nicolas, Louis, Didier

Journal:

American Political Science Review

Year:

1964

Language:

english

File:

PDF, 513 KB

english, 1964

13

Impact of low-k structure and porosity on etch processes

Darnon, Maxime, Casiez, Nicolas, Chevolleau, Thierry, Dubois, Geraud, Volksen, Willi, Frot, Théo J., Hurand, Romain, David, Thibaut L., Posseme, Nicolas, Rochat, Névine, Licitra, Christophe

Journal:

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures

Year:

2013

Language:

english

File:

PDF, 3.89 MB

english, 2013

14

ECS Transactions [ECS 219th ECS Meeting - Montreal, QC, Canada (May 1 - May 6, 2011)] - Development of Porosimetry Techniques for the Characterization of Plasma-Treated Porous Ultra Low-k Materials

Licitra, Christophe, Chevolleau, Thierry, Bouyssou, Regis, El Kodadi, Mohamed, Haberfehlner, Georg, Hazart, Jerome, Virot, Leopold, Besacier, Maxime, Posseme, Nicolas, Darnon, Maxime, Hurand, Romain,

Year:

2011

Language:

english

File:

PDF, 880 KB

english, 2011

15

New CH 4 -N 2 dry etch chemistry for poly(methyl methacrylate) removal without consuming polystyrene for lamellar copolymers application

Sarrazin, Aurelien, Posseme, Nicolas, Pimenta-Barros, Patricia, Barnola, Sebastien, Tiron, Raluca, Cardinaud, Christophe

Journal:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures

Year:

2019

Language:

english

File:

PDF, 710 KB

english, 2019

16

Block copolymer selectivity: A new dry etch approach for cylindrical applications

Sarrazin, Aurelien, Posseme, Nicolas, Pimenta-Barros, Patricia, Barnola, Sebastien, Gharbi, Ahmed, Argoud, Maxime, Tiron, Raluca, Cardinaud, Christophe

Journal:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures

Year:

2018

Language:

english

File:

PDF, 1.98 MB

english, 2018

17

ECS Transactions [ECS 219th ECS Meeting - Montreal, QC, Canada (May 1 - May 6, 2011)] - Study of Porous SiOCH Patterning Using Metallic Hard Mask: Challenges and Solutions

Posseme, Nicolas, David, Thibaut, Chevolleau, Thierry, Darnon, Maxime, Bailly, Fanny, Bouyssou, Regis, Ducote, Julien, Chaabouni, Hamed, El Kodadi, Mohamed, Licitra, Christophe, Verove, Christophe, Jo

Year:

2011

Language:

english

File:

PDF, 2.76 MB

english, 2011

18

Prospects for dielectric constant reduction in integrated circuits interconnects

Darnon, Maxime, Posseme, Nicolas, Chevolleau, Thierry, David, Thibaut L.

Journal:

MRS Proceedings

Year:

2014

Language:

english

File:

PDF, 3.84 MB

english, 2014

19

Blister formation mechanism during high dose implanted photoresist stripping

Croisy, Marion, Pargon, Erwine, Jenny, Cécile, Richard, Claire, Guiheux, Denis, Joblot, Sylvain, Campo, Alain, Possémé, Nicolas

Journal:

Microelectronic Engineering

Year:

2018

Language:

english

File:

PDF, 1.12 MB

english, 2018

20

Understanding of a new approach for silicon nitride spacer etching using gaseous hydrofluoric acid after hydrogen ion implantation

Ah-Leung, Vincent, Pollet, Olivier, Possémé, Nicolas, Garcia Barros, Maxime, Rochat, Névine, Guedj, Cyril, Audoit, Guillaume, Barnola, Sébastien

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

2017

Language:

english

File:

PDF, 2.67 MB

english, 2017

21

[IEEE 2015 China Semiconductor Technology International Conference (CSTIC) - Shanghai, China (2015.3.15-2015.3.16)] 2015 China Semiconductor Technology International Conference - PMMA removal selectivity to PS using dry etch approach for sub-10nm node applications

Sarrazin, Aurelien, Pimenta-Barros, Patricia, Posseme, Nicolas, Barnola, Sebastien, Gharbi, Ahmed, Argoud, Maxime, Tiron, Raluca, Cardinaud, Christophe

Year:

2015

Language:

english

File:

PDF, 557 KB

english, 2015

22

Thin Layer Etching of Silicon Nitride: Comparison of Downstream Plasma, Liquid HF and Gaseous HF Processes for Selective Removal after Light Ion Implantation

Pollet, Olivier, Possémé, Nicolas, Ah-Leung, Vincent, Garcia Barros, Maxime

Journal:

Solid State Phenomena

Year:

2016

Language:

english

File:

PDF, 523 KB

english, 2016

23

Low-k Integration Using Metallic Hard Masks

Joubert, O., Possémé, Nicolas, Chevolleau, Thierry, David, Thibaut, Darnon, M.

Journal:

Solid State Phenomena

Year:

2012

Language:

english

File:

PDF, 266 KB

english, 2012

24

PMMA removal selectivity to polystyrene using dry etch approach

Sarrazin, Aurelien, Posseme, Nicolas, Pimenta-Barros, Patricia, Barnola, Sébastien, Gharbi, Ahmed, Argoud, Maxime, Tiron, Raluca, Cardinaud, Christophe

Journal:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures

Year:

2016

Language:

english

File:

PDF, 4.01 MB

english, 2016

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